ASE Technology Holding constructs new Kaohsiung facility for advanced AI chip packaging, investing NT$17.8B and targeting Q2 2028 completion to meet rising demand.
ASE's investment in advanced packaging and testing infrastructure directly addresses the manufacturing bottleneck for next-generation AI and HPC chips. This expansion strengthens Taiwan's role in the global semiconductor supply chain and enables faster innovation cycles for tech giants reliant on cutting-edge chip technology.
ASE invests NT$17.8B in new Kaohsiung facility for advanced AI chip packaging
Project to create 1,470 jobs and complete by Q2 2028
Expansion includes a smart logistics center and a high-end packaging & testing building
Expansion includes a smart logistics center and a high-end packaging & testing building
Move addresses rising demand from AI, HPC, and high-speed communication sectors
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