Global Unichip (GUC) has launched its next-generation 2.5D/3D Advanced Package Technology (APT) platform. This platform leverages TSMC's latest 3DFabric® and advanced process technologies to provide comprehensive solutions for AI/HPC/Networking applications. The APT platform includes critical IPs like UCIe, GLink, and HBM, along with advanced packaging design and manufacturing services, enabling high-density integration for complex chip designs.
The launch of GUC's next-gen APT platform, built on TSMC's advanced 3DFabric®, signifies a major advancement in enabling complex, high-performance chip designs for AI, HPC, and networking. This platform's integrated IP and packaging solutions are crucial for meeting the increasing demand for greater compute density and bandwidth, positioning GUC as a key enabler of future semiconductor innovations.
GUC launches next-generation 2.5D/3D APT platform.
Leverages TSMC's 3DFabric® and advanced process technologies.
Provides integrated IP and packaging solutions for AI/HPC/Networking.
This launch is highly significant for the East Asian semiconductor ecosystem, particularly Taiwan, as it showcases the advanced capabilities of GUC and TSMC in providing cutting-edge packaging solutions that are critical for global AI and high-performance computing markets.
GUC launches next-generation 2.5D/3D APT platform.
Leverages TSMC's 3DFabric® and advanced process technologies.
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