Lead Intelligent has collaborated with OPPO to integrate chip-level 3D printing technology into the manufacturing of foldable phone hinges. This innovation, utilizing a high-precision polymer inkjet printing system, aims to enhance the microscopic support structures beneath the screen, contributing to the advanced design of the OPPO Find N6.
This partnership signifies a technological leap in foldable phone manufacturing, addressing a key challenge in screen durability and aesthetics. By applying chip-level 3D printing to hinge structures, Lead Intelligent and OPPO are pushing the boundaries of device design and user experience, potentially setting new industry standards for foldable devices and enhancing competitive differentiation in the premium smartphone market.
Lead Intelligent and OPPO are co-developing advanced hinge technology for foldable phones.
Chip-level 3D printing is being applied to enhance structural integrity and aesthetics.
This innovation aims to improve the 'seamless foldable' experience for users.
This development is particularly relevant to the East Asian market, a leading region for foldable smartphone innovation and adoption. The collaboration between a Chinese equipment manufacturer and a major Chinese smartphone brand highlights the region's strength in advanced manufacturing and consumer electronics.
The technology is integrated into the upcoming OPPO Find N6.
Lead Intelligent and OPPO are co-developing advanced hinge technology for foldable phones.
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