Lead Intelligent (先导智能) has collaborated with OPPO to integrate chip-level 3D printing technology into the manufacturing of foldable phone hinges. This innovation, utilizing a high-precision polymer inkjet printing system, aims to enhance the microscopic support structures beneath the screen, contributing to the advanced design of OPPO's Find N6 series.
This partnership signifies a technological leap in foldable phone manufacturing, moving beyond screen aesthetics to address the critical underlying structural components. The adoption of advanced 3D printing for hinges could lead to more durable, thinner, and potentially more cost-effective foldable devices, setting a new industry standard and enhancing Lead Intelligent's position as a key technology provider in the premium smartphone segment.
Lead Intelligent and OPPO are co-developing foldable phone hinge technology.
Chip-level 3D printing is being applied to hinge manufacturing.
The innovation aims to improve the microscopic support structures of foldable screens.
This collaboration highlights advancements in consumer electronics manufacturing within East Asia, specifically between a Chinese equipment provider and a major Chinese smartphone brand, impacting the global supply chain for foldable devices.
The innovation aims to improve the microscopic support structures of foldable screens.
This could set new industry standards for foldable device durability and design.
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